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From: legg <legg@nospam.magma.ca>
Newsgroups: sci.electronics.design
Subject: Re: strange cap
Date: Sun, 13 Jul 2025 11:57:41 -0400
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On Wed, 09 Jul 2025 16:01:31 -0700, john larkin <jl@glen--canyon.com>
wrote:

>https://www.mouser.com/ProductDetail/KEMET/CKC33C224KDGLCTU?qs=sGAEpiMZZMvsSlwiRhF8qtsGU%2FCnaNeQZfloC%2Fa%2FQTldKZA3leWJsw%3D%3D
>
>$27 each. I think I'll use film.

Difference in ratings between standard and 'low loss' configuration 
seems to be even thermal coupling between components and the board -
 resulting in higher current rating for the same temperature rise.

This allows higher loss from the same basic package.

So not really 'low loss'.

There are performance issues for stacked film parts that address 
the same issue, for lower temperature limits.

Not something that through-hole packages can easily address.

RL