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From: Jan Panteltje <alien@comet.invalid>
Newsgroups: sci.electronics.design
Subject: Bendable electronic parts heat up by themselves and lower the manufacturing temperature barrier
Date: Tue, 03 Dec 2024 08:13:26 GMT
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Bendable electronic parts heat up by themselves like 'heat pack' and lower the manufacturing temperature barrier
 https://www.sciencedaily.com/releases/2024/12/241202124236.htm
Source:
  DGIST (Daegu Gyeongbuk Institute of Science and Technology)
Summary:
 A research team has developed liquid-processed thin-film transistors that can maintain high performance at low temperatures
 -- They are expected to be used in the next generation of high-performance flexible electronics and
 wearable devices as they can operate on plastic substrates and maintain stable
 performance under repeated mechanical bending.