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From: Bill Sloman <bill.sloman@ieee.org>
Newsgroups: sci.electronics.design
Subject: Re: BAW
Date: Wed, 22 Jan 2025 15:30:48 +1100
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On 22/01/2025 10:52 am, Buzz McCool wrote:
> On 1/21/2025 10:56 AM, john larkin wrote:
>>
>> This has got to crush the XO business. It looks like it's a single
>> chip that's encapsulated like any other IC. XOs are complex and need
>> hermetic cans.

XOs used to use handmounted crystals. There's nothing all that 
complicated about them, but low volume manufacture tends to be a bit 
knife and fork.

> Looking through this BAW app note
> https://www.ti.com/lit/an/snaa362/snaa362.pdf, I couldn't tell BAW 
> devices would work at high altitude or in a vacuum. I have to ask 
> because the "acoustic" in the name makes me want to make sure that some 
> sort of atmosphere isn't needed.

As far as I can see these are surface acoustic wave devices. Integrated 
circuits are pretty well encapsulated. This one probably dumps any heat 
it generates into the board it is mounted on, which might run a bit 
warmer in a vacuum, but that would be the only risk I can see.

-- 
Bill Sloman, Sydney